Amir Reza Zamiri




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Amir Reza Zamiri

Home | Superconducting accelerator cavities | Micro solder joints | TiAl intermetallics | Micro plasticity | Dynamic yield functions | Cold welding

A micro joint with what microstructure yields the best reliability in electronic devices?

An energy map of the microstructure of a lead free micro solder joint in Euler space

Damage can nucleate any where inside a lead free micro solder joint during the thermomechanical fatigue cycling of the joint, which depends on initial crystal orientations in the tin phase. Usually damage develops due to a continuous recrystallization, which leads to a shear banding or a local sliding on low angle boundaries. Based on optimization techniques, we developed an elastic energy map inside Euler space to design the initial crystal orientation of tin phase in such a way that yields the highest reliability to the micro joint. Using these energy maps we found that the best initial orientations for tin phase are placed on four fibers in Euler space.

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